mpx4250d rev 5, 12/2006 freescale semiconductor technical data ? freescale semiconductor, in c., 2006. all rights reserved. i ntegrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpx4250d series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor de signed for a wide range of applications, particularly those employing a microcontro ller or microprocessor with a/d inputs. this transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to t he applied pressure. the small form factor and high reliability of on-chip integration make the freescale sensor a logical and economical choice for the automotive system engineer. features ? differential and gauge applications available ? 1.4% maximum error over 0 to 85 c ? patented silicon shear stress strain gauge ? temperature compensated over ?40 to +125 c ? offers reduction in weight and volume compared to existing hybrid modules ? durable epoxy unibody element typical applications ? ideally suited for mi croprocessor or microcontroller-based systems ordering information (1) 1. the mpx4250d series silicon pressure s ensors are available in the basic element package or with pressure port fittings that provide mounting ease and barbed hose connections. device type case no. mpx series order no. device marking unibody package (mpx4250d series) basic element 867 mpx4250d mpx4250d gauge ported element 867b MPX4250GP MPX4250GP dual ported element 867c mpx4250dp mpx4250dp mpx4250d series integrated pressure sensor 0 to 250 kpa (0 to 36.3 psi) 0.2 to 4.9 v output unibody packages pin numbers (1) 1. pins 4, 5, and 6 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 v out 4 n/c 2 gnd 5 n/c 3 v s 6 n/c gauge port option case 867b-04 style 1 basic chip carrier element case 867-08 style 1 dual port option case 867c-05 style 1
sensors 2 freescale semiconductor mpx4250d figure 1. fully integrated pressure sensor schematic table 1. maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 1000 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c v s v out gnd sensing element pins 4, 5, and 6 are no connects for unibody devices. thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry
sensors freescale semiconductor 3 mpx4250d table 2. operating characteristics ( v s = 5.1 vdc, t a = 25c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0 ? 250 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. v s 4.85 5.1 5.35 vdc supply current i o ? 7.0 10 madc minimum pressure offset @ v s = 5.1 volts (3) (0 to 85 c) 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.139 0.204 0.269 vdc full scale output @ v s = 5.1 volts (4) (0 to 85 c) 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.844 4.909 4.974 vdc full scale span @ v s = 5.1 volts (5) (0 to 85 c) 5. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. v fss ? 4.705 ? vdc accuracy (6) (0 to 85 c) 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relati onship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature with in the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressu re is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressu re applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: t he variation from nominal values, for offset or full scale span, as a percent of v fss , at 25 c. ??? 1.4 %v fss sensitivity ? v/ ? p ? 18.8 ?- mv/kpa response time (7) 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?-ms output source current at full scale output i o+ ?0.1?-madc warm-up time (8) 8. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. ??20?-ms offset stability (9) 9. offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test. ?? 0.5 ?- %v fss table 3. mechanical characteristics characteristics typ unit weight, basic element (case 867) 4.0 grams
sensors 4 freescale semiconductor mpx4250d on-chip temperature com pensation and calibration figure 2. cross sectional diagram (not to scale) figure 3. recommended power supply decoupling and output filtering (for additional output filtering, pl ease refer to application note an1535) figure 4. output versus absolute pressure figure 2 illustrates the differential/gauge pressure sensing chip in the basic chip carrier (case 867). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpx4250d series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 3 shows the recommended decoupling circuit for interfacing the output of the in tegrated sensor to the a/d input of a microprocessor or microcontroller. figure 4 shows the sensor output signal relative to pressure input. typical, minimum, and maximum output curves are shown for operation over a temperat ure range of 0 to 85 c using the decoupling circuit shown in figure 3 . the output will saturate outside of the specified pressure range. stainless steel metal cover epoxy case rtv die bond p2 sealed vacuum reference lead frame wire bond die p1 fluoro silicone die coat +5 v 1.0 f 0.01 f 470 pf gnd v s v out ips output output (volts) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 250 260 pressure in kpa typ min max transfer function: v out = v s * (0.00369*p + 0.04) error v s = 5.1 vdc temperature = 0 to 85c
sensors freescale semiconductor 5 mpx4250d nominal transfer value: v out = v s x (0.00369 x p + 0.04) (pressure error x temp. factor x 0.00369 x v s ) v s = 5.1 0.25 vdc transfer function (mpx4250d) temp multiplier ?40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 ?40 ?20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear re sponse from 0c to ?40c and from 85c to 125c. temperature error band pressure (kpa) pressure error (max) pressure error band 0 to 250 kpa 3.45 kpa 75 100 125 150 175 200 225 25 50 250 4.0 3.0 2.0 1.0 0 ?1.0 ?2.0 ?3.0 ?4.0 5.0 0 pressure error (kpa) ?5.0
sensors 6 freescale semiconductor mpx4250d package dimensions pin 1 f g n l r 123456 6 pl d seating plane -t- m a m 0.136 (0.005) t positive pressure (p1) c b m j s -a- style 1: pin 1. vout 2. ground 3. vcc 4. v1 5. v2 6. vex style 3: pin 1. open 2. ground 3. +vout 4. +vsupply 5. -vout 6. open style 2: pin 1. open 2. ground 3. -vout 4. vsupply 5. +vout 6. open max millimeters inches 16.00 13.56 5.59 0.84 1.63 0.100 bsc 2.54 bsc 0.40 18.42 30? nom 30? nom 12.57 11.43 dim a b c d f g j l m n r s min 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 max 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 min 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 notes: 1. 2. 3. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). basic element (d) case 867-08 issue n notes: 1. 2. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. r x 123456 port #2 vacuum (p2) port #1 positive pressure (p1) port #1 positive pressure (p1) pin 1 port #2 vacuum (p2) seating plane seating plane -t- -t- p g c j n b f d 6 pl w v l u s k -q- -a- m q m 0.25 (0.010) t m a m 0.13 (0.005) style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.027 0.033 0.68 0.84 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.182 0.194 4.62 4.93 w 0.310 0.330 7.87 8.38 x 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 pressure and vacuum side dual ported (dp) case 867c-05 issue f
sensors freescale semiconductor 7 mpx4250d package dimensions page 1 of 2 pressure side ported (gp) case 867b-04 issue g
sensors 8 freescale semiconductor mpx4250d package dimensions pressure side ported (gp) case 867b-04 issue g page 2 of 2
sensors freescale semiconductor 9 mpx4250d notes
mpx4250d rev. 5 12/2006 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2006. all rights reserved.
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